photoSmart42
New member
You are perhaps not aware or overlooked that the NMOS sensors used in m4/3rds are much cheaper than the other sensors (the earlier Kodak sensors in 4/3rds, for example). These are on a flex strip. All others are in a nice ceramic casing with gold plated connectors and what not.
Very different technologies and fabrication processes.
You're looking at the fab process a few steps beyond what I'm discussing. All chips (including sensors) are born on wafers. The smaller sensors are made on smaller wafers, while the larger ones require larger wafers by definition. I'm talking about taking the large-wafer chips and doing the segmenting there. What happens to the assembly beyond that to make them into sub-assemblies (whether those sub-assemblies are on wafers or in ceramic packages) is irrelevant to what I'm proposing.